SAN FRANCISCO, July 4, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Advanced Electronic Packaging - Global Market Trajectory & Analytics". The report presents fresh perspectives on opportunities and challenges in a significantly transformed post COVID-19 marketplace.
FACTS AT A GLANCE
What's New for 2022?
Global competitiveness and key competitor percentage market shares
Market presence across multiple geographies - Strong/Active/Niche/Trivial
Online interactive peer-to-peer collaborative bespoke updates
Access to our digital archives and MarketGlass Research Platform
Complimentary updates for one year
Edition: 15; Released: January 2022
Executive Pool: 4313
Companies: 38 - Players covered include Amkor Technology, Inc.; Analog Devices, Inc.; ASE Technology Holding, Co., Ltd.; Fujitsu Ltd.; Hitachi Ltd.; Ibiden Co., Ltd.; Infineon Technologies AG; Intel Corporation; Micron Technology, Inc.; Microsemi Corporation; Molex LLC; NXP Semiconductors NV; Orient Semiconductor Electronics Ltd.; Samsung Electronics Co., Ltd.; Semiconductor Manufacturing International Corporation (SMIC); Semtech Corporation; STATS ChipPAC Pte., Ltd.; Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC); Texas Instruments, Inc.; Thomas & Betts Corporation; Toshiba America Electronic Components, Inc.; TSI Group Ltd. and Others.
Coverage: All major geographies and key segments
Segments: Technology (Wafer-Level Chip-Scale Packaging, Through Silicon Via (TSV) Packaging)
Geographies: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.
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Global Advanced Electronic Packaging Market to Reach $6.8 Billion by 2026
Amid the COVID-19 crisis, the global market for Advanced Electronic Packaging estimated at US$4 Billion, is projected to reach a revised size of US$6.8 Billion by 2026, growing at a CAGR of 9.1% over the analysis period. Wafer-Level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to record a 8.5% CAGR and reach US$4.2 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Through Silicon via (Tsv) Packaging segment is readjusted to a revised 9.9% CAGR for the next 7-year period.
The U.S. Market is Estimated at $1.2 Billion in 2021, While China is Forecast to Reach $1.4 Billion by 2026
The Advanced Electronic Packaging market in the U.S. is estimated at US$1.2 Billion in the year 2021. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.4 Billion by the year 2026 trailing a CAGR of 12% over the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 6.2% and 7.7% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 7% CAGR. More
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About Global Industry Analysts, Inc. & StrategyR™
Global Industry Analysts, Inc., (www.strategyr.com) is a renowned market research publisher the world`s only influencer driven market research company. Proudly serving more than 42,000 clients from 36 countries, GIA is recognized for accurate forecasting of markets and industries for over 33 years.
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Global Industry Analysts, Inc.
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SOURCE Global Industry Analysts, Inc.