Global Semiconductor Advanced Packaging Market to Reach US$50.6 Billion by the Year 2026
Abstract: Global Semiconductor Advanced Packaging Market to Reach US$50. 6 Billion by the Year 2026 . The semiconductor advanced packaging market growth is driven by the growing trend of miniaturization.
New York, Jan. 20, 2022 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Semiconductor Advanced Packaging Industry" - https://www.reportlinker.com/p05900276/?utm_source=GNW
Constant transitions and miniaturization of nodes were regular features that the industry faced, and now ULSI fabrication resulting in increased wafer sizes are further driving market growth. With many companies focusing more on R&D, there is rise in the number of manufacturers who offer innovative products. Factors such as growing numbers of consumers using electronic appliances, consumer preference for lighter, thinner, and smaller products driving the need for electronic products with advanced architecture, and the growing demand for connected devices such as tablets and smartphones are also driving growth of semiconductor advanced packaging market. Growing interest in device miniaturization in various sectors is driving market gains. Further, the growing use of 2.5D packaging in chips and 3D IC in smartphones and other mobile devices is anticipated to spur advanced packaging demand.
Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$32.6 Billion in the year 2020, is projected to reach a revised size of US$50.6 Billion by 2026, growing at a CAGR of 7.7% over the analysis period. Flip Chip Packaging, one of the segments analyzed in the report, is projected to grow at a 7.3% CAGR to reach US$40.2 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the 2.5d/3d Packaging segment is readjusted to a revised 10.2% CAGR for the next 7-year period. This segment currently accounts for a 9.6% share of the global Semiconductor Advanced Packaging market. An incremental step from traditional 2D IC packaging technology, 2.5D packages enable finer lines and spaces. 2.5D packages are commonly used in high-end ASICs, FPGAs, GPUs, and memory cubes. Demand for high-speed flip chip packages creates an opportunity for highly integrated, multi-chip modules (MCM`s) and 2.5D/3D silicon (Si) interposer packages.
The U.S. Market is Estimated at $3.2 Billion in 2021, While China is Forecast to Reach $14.3 Billion by 2026
The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.2 Billion in the year 2021. The country currently accounts for a 9.48% share in the global market. China, the world`s second largest economy, is forecast to reach an estimated market size of US$14.3 Billion in the year 2026 trailing a CAGR of 9.8% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.3% and 6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.4% CAGR while Rest of European market (as defined in the study) will reach US$1.5 Billion by the end of the analysis period. North America is an important market for advanced packaging technologies, where growth is supported by the existence of several semiconductor companies, and increasing initiatives by the government to encourage the semiconductor and electronics manufacturing sector. Increasing demand for wireless sensor/mobile, fingerprint sensors, and CIS is expected to fuel the growth of WLCSP and Copper pillar in the Asia Pacific region. Further, the rising IoT penetration in several areas, supportive government policies in various countries, and the growing focus on smart infrastructure and smart city are fueling market growth in the region.
FI WLP Segment to Reach $3.2 Billion by 2026
In the global FI WLP segment, USA, Canada, Japan, China and Europe will drive the 5.8% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.6 Billion in the year 2020 will reach a projected size of US$2.5 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$2 Billion by the year 2026.
Select Competitors (Total 87 Featured)
Amkor Technology, Inc.
ASE Technology Holding, Co., Ltd.
China Wafer Level CSP Co., Ltd.
ChipMOS Technologies, Inc.
FlipChip International LLC
HANA Micron Inc.
Jiangsu Changjiang Electronics Technology Co., Ltd.
King Yuan Electronics Corp. (KYEC)
Nepes Corporation
Powertech Technology, Inc.
Samsung Semiconductor, Inc.
SIGNETICS
Tianshui Huatian Technology Co., Ltd.
TongFu Microelectronics Co., Ltd.
TSMC Ltd.
UTAC Holdings Ltd.
Veeco Instruments Inc.
Read the full report: https://www.reportlinker.com/p05900276/?utm_source=GNW
I. METHODOLOGY
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
Impact of COVID-19 Pandemic and Looming Global Recession: 2020
Marked as a Year of Disruption & Transformation
As the Race between the Virus & Vaccines Intensifies, Where is
the World Economy Headed in 2021?
EXHIBIT 1: World Economic Growth Projections (Real GDP, Annual
% Change) for 2020 through 2022
Impact of COVID-19 on the Semiconductor Industry Exposes the
Risk of Value Chain Modularity
Among the Hammered Companies in the Supply Chain is the ?
Semiconductor Industry?
EXHIBIT 2: Measuring the Impact of COVID-19 on the
Semiconductor Industry in Terms of Disruption & Time to
Recovery (In Months) as of May 2020
EXHIBIT 3: Supply Chain Disruptions Impact a Large Number of
Electronic Manufacturers: % Share of Companies Impacted by
Supply Chain Delays Due to COVID-19 Worldwide as of May 2020
Semiconductor Trends for Specific End-Use Categories
COVID-19 Pandemic Storm Warrants New Strategies to Help
Semiconductor Leaders Secure New Lease of Life
Falling Consumer Confidence Impacts Sales of Automotive and
Consumer Electronics
Industrial Activity Remain Subdued in 2020
EXHIBIT 4: Global PMI Index Points for the Years 2018, 2019 & 2020
An Introduction to Semiconductor Advanced Packaging
Global Market Prospects & Outlook
Key Trends to Drive Semiconductor Advanced Packaging Market
Regional Analysis
Competitive Scenario
Semiconductor Supply Chain Transitions at Various Levels
Financial Performances of Packaging Suppliers Reveals New
Growth Players
Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Digital Transformation Drive to Steer Future Growth of Advanced
Packaging Market
EXHIBIT 5: Global Digital Transformation Spending (In US$
Trillion) for the Years 2019 through 2023
IoT Ecosystem to Rev Up Opportunities for Semiconductor
Advanced Packaging
EXHIBIT 6: Global Number of IoT Connected Devices (In Billion
Units) for the Years 2016, 2018, 2020, 2022 & 2025
EXHIBIT 7: Global Investments in Industrial IoT (IIoT)
Platforms (In US$ Million) for the Years 2018, 2022 and 2025
EXHIBIT 8: Global IoT Market (In US$ Billion) by Industry for
the Years 2018 and 2022
EXHIBIT 9: World IoT Semiconductors Market by Function (2018 &
2022): Percentage Breakdown of Value Sales for Communications,
Processing, and Sensing
Increasing Functionality & Application Scope
New Packaging Technologies Crucial to Semiconductor Innovation
3D Chip Stacking Technology to Drive Future Advanced Packaging
Technology
3D InCites - Advanced Packaging for 5G
Advanced Packaging Influences Design Chain
Innovative Advanced Packaging Techniques to Flood the Market
Amkor Technology Leading Packaging Technology Innovation
Reducing the Cost of Advanced Packaging
Issues and Challenges
Solving Lithography Challenges
Warped Wafer Processing
UBM/RDL and PR Strip Challenges
UBM/RDL Etch
Trends in Consumer Electronics Sector Influence the
Semiconductor Advanced Packaging Market
Post Pandemic Recovery in CE Sector to Augment Prospects
EXHIBIT 10: Worldwide Shipments of Smartphones, Tablets, and
Laptops (in Million Units) for the Years 2019, 2021 and 2023
EXHIBIT 11: Global Smart Homes Market by Category in US$
Billion for the Years 2020 and 2022
Review of Key CE Products Driving Adoption of Semiconductor
Advanced Packaging Technology
Smartphones
EXHIBIT 12: Smartphone Penetration Rate as Share of Total
Population: 2016-2021
Tablet PCs
FOWLP and Challenges to Packaging Materials Suppliers
Automobile Electronification Trends Widen the Addressable Market
EXHIBIT 13: Breakdown of the Total Cost of Electronics in an
Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020
and 2030
EXHIBIT 14: World Automobile Production in Million Units: 2008 -
2022
Anticipated Post COVID Recovery to Revive Opportunities in
Aerospace Sector
EXHIBIT 15: Commercial Airline Revenue Growth (in %) for 2010-2020
EXHIBIT 16: Global Airlines Performance by Region: 2020 Vs 2019
Sustained High Growth in ICT Sector Augurs Well
EXHIBIT 17: World Internet Penetration Rate (in %) by
Geographic Region: June 2021
EXHIBIT 18: Breakdown of Global IP Traffic by Application Type
(in %): 2019 & 2022
EXHIBIT 19: Global Wireless Communication Market (2018 & 2020):
Percentage Breakdown of Traffic Volume by Mobile Device Type
4. GLOBAL MARKET PERSPECTIVE
Table 1: World Current & Future Analysis for Semiconductor
Advanced Packaging by Geographic Region - USA, Canada, Japan,
China, Europe, Asia-Pacific and Rest of World Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2020 through 2027 and % CAGR
Table 2: World Historic Review for Semiconductor Advanced
Packaging by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2012
through 2019 and % CAGR
Table 3: World 15-Year Perspective for Semiconductor Advanced
Packaging by Geographic Region - Percentage Breakdown of Value
Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific
and Rest of World Markets for Years 2012, 2021 & 2027
Table 4: World Current & Future Analysis for Flip Chip
Packaging by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2020
through 2027 and % CAGR
Table 5: World Historic Review for Flip Chip Packaging by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2012 through 2019
and % CAGR
Table 6: World 15-Year Perspective for Flip Chip Packaging by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2021 & 2027
Table 7: World Current & Future Analysis for 2.5D/3D Packaging
by Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2020 through 2027
and % CAGR
Table 8: World Historic Review for 2.5D/3D Packaging by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2012 through 2019
and % CAGR
Table 9: World 15-Year Perspective for 2.5D/3D Packaging by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2021 & 2027
Table 10: World Current & Future Analysis for FI WLP by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2020 through 2027
and % CAGR
Table 11: World Historic Review for FI WLP by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2012 through 2019 and % CAGR
Table 12: World 15-Year Perspective for FI WLP by Geographic
Region - Percentage Breakdown of Value Revenues for USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
for Years 2012, 2021 & 2027
Table 13: World Current & Future Analysis for FO WLP by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2020 through 2027
and % CAGR
Table 14: World Historic Review for FO WLP by Geographic Region -
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2012 through 2019 and % CAGR
Table 15: World 15-Year Perspective for FO WLP by Geographic
Region - Percentage Breakdown of Value Revenues for USA,
Canada, Japan, China, Europe, Asia-Pacific and Rest of World
for Years 2012, 2021 & 2027
Table 16: World Current & Future Analysis for Consumer
Electronics by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2020
through 2027 and % CAGR
Table 17: World Historic Review for Consumer Electronics by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2012 through 2019
and % CAGR
Table 18: World 15-Year Perspective for Consumer Electronics by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2021 & 2027
Table 19: World Current & Future Analysis for Industrial by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2020 through 2027
and % CAGR
Table 20: World Historic Review for Industrial by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World Markets - Independent Analysis of Annual Revenues
in US$ Million for Years 2012 through 2019 and % CAGR
Table 21: World 15-Year Perspective for Industrial by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2021 & 2027
Table 22: World Current & Future Analysis for Automotive by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2020 through 2027
and % CAGR
Table 23: World Historic Review for Automotive by Geographic
Region - USA, Canada, Japan, China, Europe, Asia-Pacific and
Rest of World Markets - Independent Analysis of Annual Revenues
in US$ Million for Years 2012 through 2019 and % CAGR
Table 24: World 15-Year Perspective for Automotive by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2021 & 2027
Table 25: World Current & Future Analysis for Aerospace &
Defense by Geographic Region - USA, Canada, Japan, China,
Europe, Asia-Pacific and Rest of World Markets - Independent
Analysis of Annual Revenues in US$ Million for Years 2020
through 2027 and % CAGR
Table 26: World Historic Review for Aerospace & Defense by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2012 through 2019
and % CAGR
Table 27: World 15-Year Perspective for Aerospace & Defense by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2021 & 2027
Table 28: World Current & Future Analysis for Other End-Uses by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2020 through 2027
and % CAGR
Table 29: World Historic Review for Other End-Uses by
Geographic Region - USA, Canada, Japan, China, Europe,
Asia-Pacific and Rest of World Markets - Independent Analysis
of Annual Revenues in US$ Million for Years 2012 through 2019
and % CAGR
Table 30: World 15-Year Perspective for Other End-Uses by
Geographic Region - Percentage Breakdown of Value Revenues for
USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of
World for Years 2012, 2021 & 2027
III. MARKET ANALYSIS
UNITED STATES
Table 31: USA Current & Future Analysis for Semiconductor
Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP - Independent Analysis of Annual
Revenues in US$ Million for the Years 2020 through 2027 and %
CAGR
Table 32: USA Historic Review for Semiconductor Advanced
Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2012 through 2019 and
% CAGR
Table 33: USA 15-Year Perspective for Semiconductor Advanced
Packaging by Technology - Percentage Breakdown of Value
Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and
FO WLP for the Years 2012, 2021 & 2027
Table 34: USA Current & Future Analysis for Semiconductor
Advanced Packaging by End-Use - Consumer Electronics,
Industrial, Automotive, Aerospace & Defense and Other End-Uses -
Independent Analysis of Annual Revenues in US$ Million for
the Years 2020 through 2027 and % CAGR
Table 35: USA Historic Review for Semiconductor Advanced
Packaging by End-Use - Consumer Electronics, Industrial,
Automotive, Aerospace & Defense and Other End-Uses Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2012 through 2019 and % CAGR
Table 36: USA 15-Year Perspective for Semiconductor Advanced
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Industrial, Automotive, Aerospace &
Defense and Other End-Uses for the Years 2012, 2021 & 2027
CANADA
Table 37: Canada Current & Future Analysis for Semiconductor
Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP - Independent Analysis of Annual
Revenues in US$ Million for the Years 2020 through 2027 and %
CAGR
Table 38: Canada Historic Review for Semiconductor Advanced
Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2012 through 2019 and
% CAGR
Table 39: Canada 15-Year Perspective for Semiconductor Advanced
Packaging by Technology - Percentage Breakdown of Value
Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and
FO WLP for the Years 2012, 2021 & 2027
Table 40: Canada Current & Future Analysis for Semiconductor
Advanced Packaging by End-Use - Consumer Electronics,
Industrial, Automotive, Aerospace & Defense and Other End-Uses -
Independent Analysis of Annual Revenues in US$ Million for
the Years 2020 through 2027 and % CAGR
Table 41: Canada Historic Review for Semiconductor Advanced
Packaging by End-Use - Consumer Electronics, Industrial,
Automotive, Aerospace & Defense and Other End-Uses Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2012 through 2019 and % CAGR
Table 42: Canada 15-Year Perspective for Semiconductor Advanced
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Industrial, Automotive, Aerospace &
Defense and Other End-Uses for the Years 2012, 2021 & 2027
JAPAN
Table 43: Japan Current & Future Analysis for Semiconductor
Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP - Independent Analysis of Annual
Revenues in US$ Million for the Years 2020 through 2027 and %
CAGR
Table 44: Japan Historic Review for Semiconductor Advanced
Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2012 through 2019 and
% CAGR
Table 45: Japan 15-Year Perspective for Semiconductor Advanced
Packaging by Technology - Percentage Breakdown of Value
Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and
FO WLP for the Years 2012, 2021 & 2027
Table 46: Japan Current & Future Analysis for Semiconductor
Advanced Packaging by End-Use - Consumer Electronics,
Industrial, Automotive, Aerospace & Defense and Other End-Uses -
Independent Analysis of Annual Revenues in US$ Million for
the Years 2020 through 2027 and % CAGR
Table 47: Japan Historic Review for Semiconductor Advanced
Packaging by End-Use - Consumer Electronics, Industrial,
Automotive, Aerospace & Defense and Other End-Uses Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2012 through 2019 and % CAGR
Table 48: Japan 15-Year Perspective for Semiconductor Advanced
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Industrial, Automotive, Aerospace &
Defense and Other End-Uses for the Years 2012, 2021 & 2027
CHINA
Table 49: China Current & Future Analysis for Semiconductor
Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP - Independent Analysis of Annual
Revenues in US$ Million for the Years 2020 through 2027 and %
CAGR
Table 50: China Historic Review for Semiconductor Advanced
Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2012 through 2019 and
% CAGR
Table 51: China 15-Year Perspective for Semiconductor Advanced
Packaging by Technology - Percentage Breakdown of Value
Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and
FO WLP for the Years 2012, 2021 & 2027
Table 52: China Current & Future Analysis for Semiconductor
Advanced Packaging by End-Use - Consumer Electronics,
Industrial, Automotive, Aerospace & Defense and Other End-Uses -
Independent Analysis of Annual Revenues in US$ Million for
the Years 2020 through 2027 and % CAGR
Table 53: China Historic Review for Semiconductor Advanced
Packaging by End-Use - Consumer Electronics, Industrial,
Automotive, Aerospace & Defense and Other End-Uses Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2012 through 2019 and % CAGR
Table 54: China 15-Year Perspective for Semiconductor Advanced
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Industrial, Automotive, Aerospace &
Defense and Other End-Uses for the Years 2012, 2021 & 2027
EUROPE
Table 55: Europe Current & Future Analysis for Semiconductor
Advanced Packaging by Geographic Region - France, Germany,
Italy, UK and Rest of Europe Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2020 through 2027 and
% CAGR
Table 56: Europe Historic Review for Semiconductor Advanced
Packaging by Geographic Region - France, Germany, Italy, UK and
Rest of Europe Markets - Independent Analysis of Annual
Revenues in US$ Million for Years 2012 through 2019 and % CAGR
Table 57: Europe 15-Year Perspective for Semiconductor Advanced
Packaging by Geographic Region - Percentage Breakdown of Value
Revenues for France, Germany, Italy, UK and Rest of Europe
Markets for Years 2012, 2021 & 2027
Table 58: Europe Current & Future Analysis for Semiconductor
Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP - Independent Analysis of Annual
Revenues in US$ Million for the Years 2020 through 2027 and %
CAGR
Table 59: Europe Historic Review for Semiconductor Advanced
Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2012 through 2019 and
% CAGR
Table 60: Europe 15-Year Perspective for Semiconductor Advanced
Packaging by Technology - Percentage Breakdown of Value
Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and
FO WLP for the Years 2012, 2021 & 2027
Table 61: Europe Current & Future Analysis for Semiconductor
Advanced Packaging by End-Use - Consumer Electronics,
Industrial, Automotive, Aerospace & Defense and Other End-Uses -
Independent Analysis of Annual Revenues in US$ Million for
the Years 2020 through 2027 and % CAGR
Table 62: Europe Historic Review for Semiconductor Advanced
Packaging by End-Use - Consumer Electronics, Industrial,
Automotive, Aerospace & Defense and Other End-Uses Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2012 through 2019 and % CAGR
Table 63: Europe 15-Year Perspective for Semiconductor Advanced
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Industrial, Automotive, Aerospace &
Defense and Other End-Uses for the Years 2012, 2021 & 2027
FRANCE
Table 64: France Current & Future Analysis for Semiconductor
Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP - Independent Analysis of Annual
Revenues in US$ Million for the Years 2020 through 2027 and %
CAGR
Table 65: France Historic Review for Semiconductor Advanced
Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2012 through 2019 and
% CAGR
Table 66: France 15-Year Perspective for Semiconductor Advanced
Packaging by Technology - Percentage Breakdown of Value
Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and
FO WLP for the Years 2012, 2021 & 2027
Table 67: France Current & Future Analysis for Semiconductor
Advanced Packaging by End-Use - Consumer Electronics,
Industrial, Automotive, Aerospace & Defense and Other End-Uses -
Independent Analysis of Annual Revenues in US$ Million for
the Years 2020 through 2027 and % CAGR
Table 68: France Historic Review for Semiconductor Advanced
Packaging by End-Use - Consumer Electronics, Industrial,
Automotive, Aerospace & Defense and Other End-Uses Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2012 through 2019 and % CAGR
Table 69: France 15-Year Perspective for Semiconductor Advanced
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Industrial, Automotive, Aerospace &
Defense and Other End-Uses for the Years 2012, 2021 & 2027
GERMANY
Table 70: Germany Current & Future Analysis for Semiconductor
Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP - Independent Analysis of Annual
Revenues in US$ Million for the Years 2020 through 2027 and %
CAGR
Table 71: Germany Historic Review for Semiconductor Advanced
Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2012 through 2019 and
% CAGR
Table 72: Germany 15-Year Perspective for Semiconductor
Advanced Packaging by Technology - Percentage Breakdown of
Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI
WLP and FO WLP for the Years 2012, 2021 & 2027
Table 73: Germany Current & Future Analysis for Semiconductor
Advanced Packaging by End-Use - Consumer Electronics,
Industrial, Automotive, Aerospace & Defense and Other End-Uses -
Independent Analysis of Annual Revenues in US$ Million for
the Years 2020 through 2027 and % CAGR
Table 74: Germany Historic Review for Semiconductor Advanced
Packaging by End-Use - Consumer Electronics, Industrial,
Automotive, Aerospace & Defense and Other End-Uses Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2012 through 2019 and % CAGR
Table 75: Germany 15-Year Perspective for Semiconductor
Advanced Packaging by End-Use - Percentage Breakdown of Value
Revenues for Consumer Electronics, Industrial, Automotive,
Aerospace & Defense and Other End-Uses for the Years 2012, 2021 &
2027
ITALY
Table 76: Italy Current & Future Analysis for Semiconductor
Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP - Independent Analysis of Annual
Revenues in US$ Million for the Years 2020 through 2027 and %
CAGR
Table 77: Italy Historic Review for Semiconductor Advanced
Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2012 through 2019 and
% CAGR
Table 78: Italy 15-Year Perspective for Semiconductor Advanced
Packaging by Technology - Percentage Breakdown of Value
Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and
FO WLP for the Years 2012, 2021 & 2027
Table 79: Italy Current & Future Analysis for Semiconductor
Advanced Packaging by End-Use - Consumer Electronics,
Industrial, Automotive, Aerospace & Defense and Other End-Uses -
Independent Analysis of Annual Revenues in US$ Million for
the Years 2020 through 2027 and % CAGR
Table 80: Italy Historic Review for Semiconductor Advanced
Packaging by End-Use - Consumer Electronics, Industrial,
Automotive, Aerospace & Defense and Other End-Uses Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2012 through 2019 and % CAGR
Table 81: Italy 15-Year Perspective for Semiconductor Advanced
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Industrial, Automotive, Aerospace &
Defense and Other End-Uses for the Years 2012, 2021 & 2027
UNITED KINGDOM
Table 82: UK Current & Future Analysis for Semiconductor
Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP - Independent Analysis of Annual
Revenues in US$ Million for the Years 2020 through 2027 and %
CAGR
Table 83: UK Historic Review for Semiconductor Advanced
Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2012 through 2019 and
% CAGR
Table 84: UK 15-Year Perspective for Semiconductor Advanced
Packaging by Technology - Percentage Breakdown of Value
Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and
FO WLP for the Years 2012, 2021 & 2027
Table 85: UK Current & Future Analysis for Semiconductor
Advanced Packaging by End-Use - Consumer Electronics,
Industrial, Automotive, Aerospace & Defense and Other End-Uses -
Independent Analysis of Annual Revenues in US$ Million for
the Years 2020 through 2027 and % CAGR
Table 86: UK Historic Review for Semiconductor Advanced
Packaging by End-Use - Consumer Electronics, Industrial,
Automotive, Aerospace & Defense and Other End-Uses Markets -
Independent Analysis of Annual Revenues in US$ Million for
Years 2012 through 2019 and % CAGR
Table 87: UK 15-Year Perspective for Semiconductor Advanced
Packaging by End-Use - Percentage Breakdown of Value Revenues
for Consumer Electronics, Industrial, Automotive, Aerospace &
Defense and Other End-Uses for the Years 2012, 2021 & 2027
REST OF EUROPE
Table 88: Rest of Europe Current & Future Analysis for
Semiconductor Advanced Packaging by Technology - Flip Chip
Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent
Analysis of Annual Revenues in US$ Million for the Years 2020
through 2027 and % CAGR
Table 89: Rest of Europe Historic Review for Semiconductor
Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D
Packaging, FI WLP and FO WLP Markets - Independent Analysis of
Annual Revenues in US$ Million for Years 2012 through 2019 and
% CAGR
Table 90: Rest of Europe 15-Year Perspective for Semiconductor
Advanced Packaging by Technology - Percentage Breakdown of
Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI
WLP and FO WLP for the Years 2012, 2021 & 2027
Table 91: Rest of Europe Current & Future Analysis for
Semiconductor Advanced Packaging by End-Use - Consumer
Electronics, Industrial, Automotive, Aerospace & Defense and
Other End-Uses - Independent Analysis of Annual Revenues in US$
Million for the Years 2020 through 2027 and % CAGR
Table 92: Rest of Europe Historic Review for Semiconductor
Advanced Packaging by End-Use - Consumer Electronics,
Industrial, Automotive, Aerospace & Defense and Other End-Uses
Markets - Independent Analysis of Annual Revenues in US$
Million for Years 2012 through 2019 and % CAGR
Table 93: Rest of Europe 15-Year Perspective for Semiconductor
Advanced Packaging by End-Use - Percentage Breakdown of Value
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