As Apple’s next-generation iPhone 5S enters mass production, we’re seeing all of the puzzle pieces fall into place. Photos are leaking, new details are trickling out, and rumors of production issues and possible delays are spreading like wildfire, just like they do every year. Now, a new report from Weibo user and claimed insider C Technology may reveal full specs for the iPhone 5S alongside new images of the device’s case assembly seemingly taken inside Foxconn’s factory.
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Where specs are concerned, the upcoming new flagship iPhone will be the biggest hardware upgrade ever for an “S” device if the report’s claims pan out. Highlights include a 4-inch IGZO display with the same Retina resolution as the iPhone 5, an A6 processor clocked a bit faster than the current model, quad-core SGX 554MP4 graphics, 2GB of RAM and an upgraded LTE radio.
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Where new hardware is concerned, the report claims Apple’s iPhone 5S will include an upgraded 12-megapixel camera, a dual-LED flash, NFC and a fingerprint scanner. Skeptics dismissed early rumors suggesting a fingerprint scanner would be included in the new iPhone, however numerous subsequent reports including one from Reuters suggest Apple will finally make use of its AuthenTec acquisition in the iPhone 5S.
The new hardware upgrades in Apple’s iPhone 5S are unconfirmed for the time being, of course, but an earlier exclusive report from BGR revealing a complete internal overhaul suggested Apple was indeed making room for new components in its next-generation flagship iPhone.
The leaked photos of Apple’s aluminum iPhone 5S shell from C Technology follow below.
This article was originally published on BGR.com